BUILDING OF CIRCUIT ON BOARD 2

in this class,, we were doing 2 type of board, 1st circuit was double-sided board and all the component is true holes components. 2nd circuit was single-sided components buth half of components were true holes components and the other half were semiconductor components. It was very challenging because SMD components were too small and hard to soldered it.

EXPOSING TO UV LIGHT

for the 1st circuit ,process of exposing to UV light was a litle bit messy because we must attach the artwork on double-sided board with the same pair. If not,we would face difficulty when we want to drill because the holes not exactly same with both side. 1st time I did it, I made a worst mistake which is I did both side of board with same side of artwork. So ,my board was truely wrong..huhu.. Sorry to En. Redzuan because im wasting the board.. ;) And, 4 the 2nd time, Alhamdulillah,, I succeeded to do it . After exposed to UV for front side, then we must change to the back side to exposed it to UV. After we pull out the white layer of board, don't exposed it too long to the surronding because the green layer is too sensitive to the light. So, you must turn off the light while doing this process.

for the 2nd circuit ,, it was easy and I managed to do this process for 2 board within 5 minutes :) it was easy because it was single-sided but it was a little bit small because of SMD components .

DEVELOPING

Developing process is use sodium solution to tear off the green layer on the board.

for the 1st circuit,, we must hold ourselves the board and mixed it in the sodium regularly. After all the green layer disappear, wash and dry it with towel provided.

for the 2nd circuit,,the process was easy because we just placed the board inside sodium solution ,and remember, the track of circuit must be on top while placing. and then,,mixed it regularly until green layer disappear. after that , the process same with circuit 1.

ETCHING

Etching process is use acid solution to tear off copper layer that not going to used.In this time , we did etching process by using specific machine. But it also take a long time I think.

for the both circuit, just placed the board inside the machine and moved it up-down regularly to tear off copper layers.It will be faster if many bubbles produced.

after finish , wash it with water and dry it with towel provided.

CUTTING

cut both board with the size or shape you want but make sure that you didn't cut the track of circuit.

DRILLING

drilling is the process to make holes of components on the board.

for the 1st circuit, I cannot matched both side of board with same holes because my artwork not the matched pair. But ,luckily, it was not too much different.my drilling was not too proper because size of holes to drill was too small,make the copper around the holes scratched.

for the 2nd circuit, it was easy to drill because size of holes was a little bit big .

ASSEMBLING

assembled all the components of circuit 1 was easy because all of it is true-hole components. It is easy to see and hold :)

for 2nd circuit, it make me worried to take care of those SMD components because it was too small and canot hold it by hand. Hold it by using specific tools .

SOLDERING

I cannot managed to finish soldering both circuit in workshop because time was running out.

for the 1st circuit, En. Redzuan told us that he will make a new artwork with single-sided because he found that we face many difficulty to handle the double-sided board. We must ue back the component given in the next class. So , I didn't soldered the 1st circuit.

for the 2nd circuit, I soldered it carefully because SMD components was too small.

TESTING

i'll test it in the next class.

xoxo~~

p/s= cannot post any picture that i've taken because the line internet was too slow :(